Logic Product Development Project

Competitive Analysis –Reverse Engineering Index

			DIE SIZE in Microns			Active
Vendor	Device	Package	L	W	H	Under Pads	Year
Fairchild	NC7SZ125L6X	6P- MicroPack	328	376	158	NO	1999
Fairchild	NC7SZU04P5X	SC70-5	322	420	206	YES	2005
Fairchild	NC7WZ14P6X	SC70-6	378	602	216	YES	2005
NXP	74AUP1G386GM	6-XSON	414	536	204	YES
NXP	74LVC1G04GW	UMT5	334	410	192	YES
ON	M74VHC1G125DFT2G	SOT353	342	370	208	NO
ON	NL17SZ17DFT2G	SOT353	356	404	208	NO	2009
TI	SN74AUP1GOOYZPR	5DSBGA	1354	854	260	NO
TI	SN74LVC1G126	DRL	486	500		NO
TI	SN74LVC1G08DRYR	6-SON	486	500	198	NO
Toshiba	TC7SZ00FU	5-SSOP	544	570	114	NO

Note: the TI SN74LVC126 is an extensive reverse engineering effort while the others are overviews.