Competitive Analysis
Logic Product Development Project
Device
SN74LVC1G126DRL
Function Single Buffer
–Tri State Output
Competitor
TI
Package
DRL
Die Size 500u X 486u Thickness 198u
Die Orientation
Active Surface Up (uses die that normally faces down)
Technology
LVC 5.5V to 1.65v
An online all layer GIMP compatible photo set is on the
server.(350 MB) Click here.
Extracted schematic design
notes
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Die Photo Metal 2 |
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Die Overview Observations: Link to high-resolution
5300 X 5700 pixels (15 megabytes) Photo with
annotations. Photo without
annotations. Photo
from laboratory unprocessed. Note: The green annotations are derived from the
Metal 1 Level and the orange annotations from the Diffusion level photo. |
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Die Photo Metal 1 |
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Die Overview Link to high-resolution
5300 X 5700 pixels (15 megabytes) Photo with
annotations. Photo without
annotations. Photo
from laboratory unprocessed. Note: The green annotations are derived from the
Metal 1 Level and the orange annotations from the Diffusion level photo. |
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Die Photo Poly Level |
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Die Overview Link to high-resolution
5300 X 5700 pixels (15 megabytes) Photo with
annotations. Photo without
annotations. Photo from laboratory unprocessed. Note: The green annotations are derived from the
Metal 1 Level and the orange annotations from the Diffusion level photo. |
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Die Photo Diffusion Level |
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Die Overview Link to
high-resolution 5300 X 5700 pixels
(15 megabytes) Photo with
annotations. Photo without
annotations. Photo from laboratory unprocessed. Note: The green annotations are derived from the
Metal 1 Level and the orange annotations from the Diffusion level photo. |
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Package Information TI
SN74LVC1G126DRL |
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Top View
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Top with mold compound removed |
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Top with mold compound removed This die is pin optimized for a SOT-25 or SOT-353 (SC70) application. Pin one remains in the lower left corner and the leads passing under the die allow for the outputs to go to the same pins as the SOT-25. |
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Package Details TI
SN74LVC1G126DBV |
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Top View Since the die is down the lab ended
up with a photo of the lead frame. This is equivalent to a SOT 25 package. |
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