Competitive Analysis

Logic Product Development Project

Device M74VHC1G125DFT2G
Function Tri-State Buffer 24mA at 3.3V:

Datasheet local online

Competitor ON Semiconductor

Package SOT353

Die Size 370u X 342u Thickness 208u

Die Orientation Active Surface Down

Technology AHC 5.5V – 2.0V

Die Photo
	Die Overview Observations: No active circuits under bond pads.

Die X-rays ON M74VHC1G125DFT2G
	Top of Package Looking Through Die Die is Down Observation: Large die mounting pad associated with pin three.
	Side View
	Angled View

Package Details ON M74VHC1G125DFT2G
	Top View Size relative to 1mm on ruler.
	Symbol
	Bottom