Competitive Analysis
Logic Product Development Project
Device
NC7SZ125L6X
Function Tri-State
Buffer 24mA at 3.3V
Competitor
Fairchild
Package
6P- MicroPack
Die Size
376u X 328u Thickness: 158u
Die Orientation
Active Surface Up
Technology
LVC 5V to 1.65V Vcc crosses to TI SN74LVC1G125
however TI does not have this package.
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Die Photo |
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Die Overview Observations: Circa 2005. |
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Die X-rays Fairchild
NC7SZ125L6X |
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Top View The substrate is built up with bond
wire connection points and a die pad on the top level. The path then goes through vias to the
package pads: Observation: Notice that the bond wires have balls
on both ends. It appears a stitch on
ball exists at the die bond pad. Die centerline skewed leftward. Two bonding sites for pin 5. Neither
is used. |
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Side ViewObservation: The wire exist angle is exceptionally
flat. |
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Angled ViewMore detail of package via structure is revealed. |
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Package Details Fairchild NC7SZ125L6X |
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Top View Size relative to 1mm on ruler. |
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Symbol |
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Bottom |
