Competitive Analysis

Logic Product Development Project

Device TC7SZ00FU
Function 2 Input NAND Gate

Datasheet local online

Competitor Toshiba

Package 5-SSOP

Die Size 570u X 486u Thickness 114u

Die Orientation Active Surface Down

Technology VCC 5V to 2V 7 volts is allowed.

Die Photo
	Die Overview Observations: No active circuits under bond pads.

Die X-rays Toshiba TC7SZ00FU
	Top of Package Looking Through Die Die is Down Observation: Large die mounting pad associated with pin three.
	Side View
	Angled View

Package Details Toshiba TC7SZ00FU
	Top View Size relative to 1mm on ruler.
	Top View l Alternate
	Bottom