Competitive Analysis

Logic Product Development Project

Device NL17SZ17DFT2G
Function Single Buffer with Schmitt Trigger Input

Datasheet local online

Competitor ON Semiconductor

Package SOT353

Die Size 404u X 356u Thickness 208u

Die Orientation Active Surface Down

Technology LVC 5V to 2V

Die Photo
	Die Overview Observations: No active circuits under bond pads. Alternate photo.

Die X-rays ON NL17SZ17DFT2G
	Top of Package Looking Through Die Die is Down Observation: Large die mounting pad associated with pin three.
	Side View
	Angled View

Package Details ON NL17SZ17DFT2G
	Top View Size relative to 1mm on ruler.
	Top View l Alternate
	Bottom