Competitive Analysis
Logic Product Development Project
Device
SN74LVC1G08DRYR
Function 2 Input Positive
AND Gate
Competitor
TI
Package
6-SON
Die Size
500u X 486u Thickness 198u
Die Orientation
Active Surface Up
Technology
LVC 5.5V to 1.65v
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Die Photo |
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Die Overview Observations: |
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Die X-rays TI
SN74LVC1G08DRYR |
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Top View |
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Side ViewObservation: Notice lack of layers or vias as
compared to other surface mount packages. |
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Angled View |
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Package Details TI
SN74LVC1G08DRYR |
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Top View Size relative to 1mm on ruler. |
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Bottom |
