Competitive Analysis

Logic Product Development Project

Device SN74AUP1GOOYZPR
Function 2 Input Positive NAND

Datasheet local online

Competitor TI

Package 5DSBGA

Die Size 1354u X 854u Thickness 260u

Die Orientation Active Surface Down

Technology AUP 3.6V 0.8V

Die Photo
	Die Overview Observations: No active circuits under bond pads. Circa 2004. Large amount of unused space as die is much larger for chip scale package.

Die X-rays TI SN74AUP1GOOYZPR
	Top View
	Side View
	Angled View

Package Details TI SN74AUP1GOO
	Top View Size relative to 1mm on ruler.
	Top View l Alternate
	Bottom